Display device and manufacturing method thereof

ABSTRACT

A display device includes a substrate of a display panel, including: a display area and a non-display area, an upper surface and a lower surface each in the display area and the non-display area, and side surfaces connecting the upper and lower surfaces to each other; a signal line on the upper surface of the substrate; a circuit substrate on a side surface of the substrate; and a connection electrode on the upper surface of the substrate in the non-display area thereof, where the connection electrode electrically connects the signal line and the circuit substrate to each other. In the non-display area, the substrate further includes: a first etched portion recessed from the side surface at which the circuit substrate is disposed, and a second etched portion extending from the first etched portion toward the signal line, and the connection electrode is in the first and second etched portions.

This application is a divisional application of U.S. patent applicationSer. No. 15/961,966 filed on Apr. 25, 2018, which claims priority toKorean Patent Application No. 10-2017-0102609, filed on Aug. 11, 2017,and all the benefits accruing therefrom under 35 U.S.C. § 119, thecontent of which in its entirety is herein incorporated by reference.

BACKGROUND (1) Field

The present disclosure herein relates to a display device, and moreparticularly to a display device and a manufacturing method thereof.

(2) Description of the Related Art

Typically, a display panel and a driving chip of a display device areelectrically connected to each other within a module assembly equipmentin a process performed after forming the display panel. This combiningprocess for electrically connecting the display panel and driving chipto each other is largely classified into a chip on lass (“COG”) schemeand a tape automated bonding (“TAB”) scheme according to a driving chipmounting scheme.

The COG scheme is for directly mounting a driving chip on a gate areaand a data area of a display panel and delivering an electrical signalto the display panel. The driving chip is typically bonded to thedisplay panel using an anisotropic conductive film (“ACF”).

The TAB scheme is for bonding, to a display panel, a tape carrierpackage on which a driving chip is mounted. In this scheme, the displaypanel is bonded to one end of the tape carrier package using an ACF anda main circuit substrate is bonded to the other (opposing) end of thetape carrier package.

In order to extend and maximize a display area of a display device onwhich an image is displayed, a structure is being studied in which atape carrier package is disposed on a side of the display panel.

SUMMARY

The present disclosure provides a display device in which a non-displayarea may be reduced and a display area may be increased.

An embodiment of the invention provides a display device including: asubstrate of a display panel which displays an image with light, thesubstrate including: a display area at which the image is displayed anda non-display area at which the image is not displayed, an upper surfacedisposed in both the display area and the non-display area, a lowersurface facing the upper surface, disposed in both the display area andthe non-display area, and a plurality of side surfaces connecting theupper surface and the lower surface to each other; a signal line whichreceives a signal at the non-display area and provides the receivedsignal to the display area, the signal line disposed on the uppersurface of the substrate; a circuit substrate from which the signal isprovided to the signal line, the circuit substrate disposed on a sidesurface among the side surfaces of the substrate; and a connectionelectrode disposed on the upper surface of the substrate in thenon-display area thereof, where the connection electrode electricallyconnects the signal line and the circuit substrate to each other. In thenon-display area, the substrate further includes: a first etched portionrecessed from the side surface at which the circuit substrate isdisposed, and a second etched portion extending from the first etchedportion toward the signal line, and the connection electrode is disposedin the first etched portion and the second etched portion.

In an embodiment, the upper surface may include a horizontal portion onwhich the signal line is disposed, the horizontal portion disposed in aplane defined by first and second directions, and the second etchedportion in which the connection electrode is disposed is inclined fromthe horizontal portion to the first etched portion.

In an embodiment, the lower surface may include a first portion facingthe horizontal portion, and a second portion inclined from the firstportion and connecting the first portion to the side surface.

In an embodiment, the display device may further include an auxiliaryconnection electrode disposed on the connection electrode andelectrically contacting the signal line and the connection electrode.

In an embodiment, the substrate may further include an auxiliary etchedportion extended from the inclined second etched portion to the signalline, the auxiliary etched portion recessed from the horizontal portionin the thickness direction, and the connection electrode disposed in thesecond etched portion may be further disposed in the auxiliary etchedportion.

In an embodiment, the signal line disposed on the horizontal portion ofthe upper surface may extend to be disposed on the connection electrodedisposed in the auxiliary etched portion.

In an embodiment, in the thickness direction, the second etched portionmay be recessed from the horizontal portion of the upper surface andextend from the horizontal portion to terminate at the side surface atwhich the circuit substrate is disposed.

In an embodiment, the signal line may include a pad at a terminal endthereof, the pad being adjacent to the side surface at which the circuitsubstrate is disposed, and a conductive line which is connected to thepad and extends to the display area.

In an embodiment, the circuit substrate may include a pad through whichthe signal is provided from the circuit substrate to the pad of thesignal line, and at the first etched portion, the pad of the circuitsubstrate may be electrically connected to and faces the connectionelectrode.

In an embodiment, the display device may further include an isotropicconductive film disposed between the pad of the circuit substrate andthe connection electrode.

In an embodiment, the display device may further include an uppersubstrate facing the substrate on which the signal line is disposed, anda substrate combining member which couples the upper substrate to thesubstrate on which the signal line is disposed. At the second etchedportion, the signal line may be disposed between the connectionelectrode and the substrate combining member.

In an embodiments of the invention, a display device includes: asubstrate of a display panel which displays an image with light, thesubstrate including: a display area at which the image is displayed anda non-display area at which the image is not displayed, an upper surfacedisposed in both the display area and the non-display area, a lowersurface facing the upper surface, disposed in both the display area andthe non-display area, and a plurality of side surfaces connecting theupper surface and the lower surface to each other; a signal line whichreceives a signal at the non-display area and provides the receivedsignal to the display area, the signal line disposed on the uppersurface of the substrate; a circuit substrate from which the signal isprovided to the signal line, the circuit substrate disposed on a sidesurface among the side surfaces of the substrate; and a connectionelectrode disposed on the upper surface of the substrate in thenon-display area thereof, where the connection electrode electricallyconnects the signal line and the circuit substrate to each other. In thenon-display area, the upper surface includes a horizontal portion, andan inclined portion which is inclined from the horizontal portion andconnects the horizontal portion and the side surface on which thecircuit substrate is disposed to each other, the signal line is disposedon the horizontal portion of the upper surface, and the connectionelectrode is disposed on the inclined portion of the upper surface andextends toward the lower surface along the side surface on which thecircuit substrate is disposed.

In an embodiment, the lower surface may include a first portion facingthe horizontal portion, and a second portion inclined from the firstportion and connecting the first portion and the side surface to eachother.

In an embodiment, the signal line may include a pad at a terminal endthereof, the pad contacting the connection electrode, and a conductiveline which is connected to the pad and extends to the display area, andan end surface of the connection electrode may face and contact an endsurface of the pad of the signal line.

In an embodiment, the circuit substrate may include a pad electrodethrough which the signal is provided from the circuit substrate to thesignal line, and the pad electrode may be electrically connected to andface the connection electrode disposed on the side surface.

In an embodiment, the display device may further include a conductiveadhesive member disposed between the pad electrode of the circuitsubstrate and the connection electrode disposed on the side surface.

In an embodiments of the invention, a manufacturing method of a displaydevice, includes: etching a first portion of a substrate of displaypanel which displays an image with light, at an upper surface of thesubstrate, the etching the first portion reducing a thickness of thesubstrate at a non-display area of the display panel; etching a secondportion of the substrate, a side surface thereof, the second portionextending from the first portion to be connected therewith; disposing aconnection electrode in the first etched portion and in the secondetched portion of the substrate; disposing outside of the first andsecond etched portions of the substrate, a signal line on the uppersurface, to contact the connection electrode disposed in the first andsecond etched portions; and disposing a circuit substrate on the sidesurface at which the second portion is etched to be electricallyconnected to the connection electrode disposed in the first and secondetched portions.

In an embodiment, the signal line outside of the first and second etchedportions of the substrate may extend to be disposed overlapping theconnection electrode disposed in the first and second etched portions.

In an embodiment, the upper surface may include a horizontal portion onwhich the signal line is disposed, the horizontal portion disposed in aplane defined by first and second direction, and the first etchedportion in which the connection electrode is disposed may be inclinedfrom the horizontal portion to the second etched portion.

In an embodiment, an end surface of the connection electrode may faceand contact an end surface of the signal line.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate exemplaryembodiments of the invention and, together with the description, serveto explain principles of the invention. In the drawings:

FIG. 1 is a perspective view of an embodiment of a display deviceaccording to the invention;

FIG. 2 is a top plan view of the display device according to theinvention;

FIG. 3 is a top plan view of an embodiment of a display panel accordingto the invention;

FIG. 4 is an enlarged top plan view of an embodiment of area AA shown inFIG. 3;

FIG. 5A is a cross-sectional view of the area AA along I-I′ shown inFIG. 4 according to the invention;

FIG. 5B is a cross-sectional view of a modified embodiment of the areaAA along I-I′ shown in FIG. 4 according to the invention;

FIGS. 6A to 6E are cross-sectional views showing an embodiment of amanufacturing method of a display device according to the invention;

FIG. 7 is an enlarged top plan view of another embodiment of the area AAarea shown in FIG. 3 according to the invention;

FIG. 8 is a cross-sectional view of the area AA along II-IF shown inFIG. 7 according to the invention;

FIG. 9 is an enlarged cross-sectional view of another embodiment of adisplay device according to the invention; and

FIG. 10 is a cross-sectional view of the display device along shown inFIG. 9.

DETAILED DESCRIPTION

The invention may be subjected to many modifications and have severalforms, and specific embodiments thereof are illustrated in the drawingsand described in detail in the specification. However, it will beunderstood that the invention is not intended to be limited to thespecific forms set forth herein, and all changes, equivalents, andsubstitutions included in the technical scope and spirit of theinvention are included.

Referring to the drawings, like reference numerals refer to likecomponents throughout. In the drawings, the dimensions of the structuresmay be exaggerated or reduced for clarity of illustration. Terms such asfirst, second, and the like may be used to describe various components,but these components should not be limited by the terms. The terms areused only for the purpose of distinguishing one component from anothercomponent. For instance, a first component may be referred to as asecond component, or similarly, a second component may be referred to asa first component, without departing from the scope of the invention.

It will be understood that when an element is referred to as beingrelated to another element such as being “on” another element, it can bedirectly on the other element or intervening elements may be presenttherebetween. In contrast, when an element is referred to as beingrelated to another element such as being “directly on” another element,there are no intervening elements present.

The singular forms “a,” “an” and “the” are intended to include theplural forms as well, unless the context clearly indicates otherwise.“At least one” is not to be construed as limiting “a” or “an.” “Or”means “and/or.” As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

It will be understood that the terms “comprises” or “have,” when used inthis specification, are intended to specify the presence of statedfeatures, integers, steps, operations, components, a combinationthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, components, or acombination thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a perspective view of an embodiment of a display deviceaccording to the invention. FIG. 2 is a top plan view of the displaydevice according to the invention. FIG. 3 is a top plan view of anembodiment of a display panel according to the invention.

Referring to FIGS. 1 and 2, the display device DD includes the displaypanel DP, a main circuit substrate PB, a gate driving unit GDC, a datadriving unit DDC and a signal control unit SC.

According to an embodiment of the invention, the display device DD maybe applied in a relatively small electronic device such as a mobilephone, a tablet (computer/processor), a game console or a smart watch aswell as a middle- or relatively large-sized electronic device such as anotebook (computer/processor) or a television.

According to an embodiment of the invention, the display panel DP may beprovided as any one of an organic light emitting display panel, a liquidcrystal display panel, a plasma display panel, an electrophoreticdisplay panel, a microelectromechanical system (“MEMS”) display paneland an electrowetting display panel.

In detail, the display panel DP may include a first (display) substrate100 and a second (display) substrate 200 which is disposed on the firstdisplay substrate 100. The first substrate 100 and the second substrate200 may be provided as including a glass (base) substrate or a plastic(base) substrate. As used herein, reference numerals 100 and 200 may beused to indicate the overall first or second substrate, as well as therespective base substrate thereof on which other layers or elements aredisposed.

As an example, when the display panel DP is implemented as a liquidcrystal panel, a liquid crystal layer as an optical medium or lighttransmittance control layer may be disposed between the first substrate100 and the second substrate 200.

As another example, when the display panel DP is implemented as anorganic electroluminescent display panel, a (display) circuit layerincluding light emitting unit elements which generate and emit light maybe disposed in the first substrate 100 such as on the base substratethereof. In this case, the second substrate 200 may be provided as anencapsulation substrate or a thin film encapsulation layer coveringelements of the circuit layer. In addition, although not shown in thedrawings, an input sensing unit for sensing an external input may bedisposed on or in the display panel DP. In an embodiment, for example,the external input may mean a touch from an external object to the inputsensing unit and/or the display panel DP.

The display panel DP is disposed in a plane which is parallel to asurface or plane defined by a first direction DR1 and a second directionDR2 crossing each other. A normal direction relative to the plane of thedisplay panel DP is indicated by a third direction DR3. The thirddirection DR3 indicates a thickness direction of the display deviceand/or components thereof. A front surface and a rear surface of eachmember are defined opposing each other along the third direction DR3.However, directions indicated by the first to third directions DR1, DR2and DR3 are relative, and may be converted to other directions.

Referring to FIG. 2, the first substrate 100 includes a plurality ofgate lines GL1 to GLn and a plurality of data lines DL1 to DLm whichintersect with the gate lines GL1 to GLn. In addition, the firstsubstrate 100 includes a pixel PX provided in plurality connected to thegate lines GL1 to GLn and data lines DL1 to DLm. The gate lines GL1 toGLn are connected to the gate driving unit GDC. The data lines DL1 toDLm are connected to the data driving unit DDC.

For convenience of explanation, FIG. 2 only illustrates a portion of theplurality of gate lines GL1 to GLn and a portion of the plurality ofdata lines DL1 to DLm.

In addition, FIG. 2 also only illustrates a portion of the plurality ofpixels PX. Each pixel PX is connected to a corresponding gate line amongthe gate lines GL1 to GLn and to a corresponding data line among thedata lines DL1 to DLm.

The pixels PX may be classified into a plurality of groups according toa color displayed thereby. In other words, the pixels PX mayrespectively display one of primary colors. The primary colors mayinclude green, blue and white. However, the primary colors are notlimited thereto, and may further include various colors such as yellow,cyan and magenta.

The signal control unit SC may be mounted on the main circuit substratePB. As an embodiment of the invention, the signal control unit SC isillustrated to be mounted on the main circuit substrate PB, but thesignal control unit SC may be mounted on an external circuit substrate(not shown). In this case, the external circuit substrate may be anelement separate from the main circuit substrate PB and electricallyconnected to the main circuit substrate PB.

The signal control unit SC may receive image data and a control(driving) signal from an external graphic control unit (not shown). Thecontrol signal may include a vertical synchronizing signal that is asignal for distinguishing frame periods from each other, a signal fordistinguishing horizontal periods, namely, horizontal blanking signalthat is a row distinguishing signal, a data enable signal that has arelatively high level only during a data output period in order toindicate a data input area and a clock signal. However, the controlsignal is not limited thereto, and may further include a plurality ofsignals for driving the gate driving unit GDC and the data driving unitDDC.

In response to the control signal, the signal control unit SC generatesa gate control signal for controlling the gate driving unit GDC, anddelivers the gate control signal to the gate driving unit GDC. Thesignal control unit SC generates a data control signal for controllingthe data driving unit DDC and delivers the data control signal to thedata driving unit DDC.

The gate driving unit GDC is provided in plurality and generates gatesignals during the frame periods on the basis of the gate control signalprovided thereto. The gate driving unit GDC outputs the gate signals tothe gate lines GL1 to GLn. The gate signals may be sequentially outputin response to horizontal periods. In addition, although not shown inthe drawings, a gate circuit substrate GCB may be provided in pluralityelectrically connected to each other.

It is described that the gate driving unit GDC according to anembodiment of the invention is an individual unit provided in plurality,but is not limited thereto. In other words, the gate driving unit GDCmay be provided in a single unitary gate driving unit GDC to generatethe gate signals. In an embodiment, for example, the display device DDincluding one single gate driving unit GDC may be applied to a mobilephone, etc.

The gate driving unit GDC may include a gate driving chip GC and thegate circuit substrate GCB on which the gate driving chip GC is mounted.The gate driving chip GC may be provided in plurality. As an example,the gate circuit substrate GCB may be provided as a flexible printedcircuit and may be provided in one-to-one correspondence with the gatedriving chips GC, to form a plurality of gate driving units GDC.

According to an embodiment of the invention, the gate circuit substrateGCB may be disposed at one side among a plurality of sides of thedisplay panel DP defined in the top plan view. The gate circuitsubstrate GCB is electrically connected to the gate lines GL1 to GLn todeliver the gate signals output from the gate driving chip GC to thegate lines GL1 to GLn.

According to an embodiment of the invention, the gate driving unit GDCand the data driving unit DDC may be provided as a tape carrier package

(“TCP”).

In a conventional structure, in a typical case, a pad unit of the gatecircuit substrate GCB is disposed on the first substrate 100 of thedisplay panel DP such as in a non-display area NDA thereof. In thiscase, a top surface of the display panel DP essentially includes a padarea at which a pad unit of the gate circuit substrate GCB is disposed.A display area DA of the display panel DP is an area at which an imageis displayed with emitted light, and the non-display area NDA is an areaat which the image is not displayed. Light may be generated and emittedat the display area DA, without being limited thereto.

According to one or more embodiment of the invention, as the gatecircuit substrate GCB is disposed on one side surface among a pluralityof side surfaces of the display panel DP, a planar area of the topsurface of the first substrate 100 at which the pad unit of the gatecircuit substrate GCB is disposed is obviated. That is, the non-displayarea NDA is reduced as omitting the planar area for the pad unit of thegate circuit substrate GCB.

Sides of the display device DD lengthwise extend in a direction. Asillustrated in FIG. 3, in a conventional structure, the non-display areaNDA of the display panel DP includes a first area dx at which the padunit of the gate circuit substrate GCB is to be disposed. In otherwords, the non-display area NDA at a side of the display device DD isdefined by a product of the width (dx) along the first direction DR1 anda length along the second direction DR2, such as along an entire lengthin the second direction DR2.

However, for one or more embodiment of the invention, since the pad unitof the gate circuit substrate is not disposed to occupy a planar area ofthe first substrate 100 at the non-display area NDA of the display panelDP, the non-display area NDA may be reduced from the first area dx to asecond area dr in the first direction DR1. Again, the non-display areaNDA at a side of the display device DD is defined by a product of thewidth (dr) along the first direction DR1 and a length along the seconddirection DR2, such as along an entire length in the second directionDR2. Since dr is smaller than dx, a total planar area of the non-displayarea NDA is reduced as compared with the conventional structuredescribed above.

In other words, since the gate circuit substrate GCB in one or moreembodiment of the invention is not disposed on the top surface of thesubstrate of the display panel DP, the non-display area NDA may begenerally reduced. Accordingly, with the reduction of the non-displayarea NDA, the display area DA of the display panel DP according to oneor more embodiment of the invention may be increased as compared to thatof the conventional structure.

The display area DA and the non-display area NDA may be defined byportions of a top surface of a (display) substrate at which an image issubstantially displayed, not portions of a side surface of the displaypanel DP. Accordingly, in a same-sized display panel, when thenon-display area NDA is further reduced, the display area DA on which animage is displayed may be increased.

The data driving unit DDC may be provided in plurality. The data drivingunit DDC generates grayscale voltages according to image data providedfrom the signal control unit SC on the basis of a data control signalreceived from the signal control unit SC. The data driving unit DDCoutputs the grayscale voltages to the data lines DL1 to DLm as the datasignals.

The data driving unit DDC is described as provided in plurality, but isnot limited thereto. In other words, the data driving unit DDC may beprovided in a single data driving unit to generate the grayscalevoltages. In an embodiment, for example, the display device DD includingone single data driving unit may be applied to a mobile phone, etc.

The data driving unit DDC may include a data driving chip DC and a datacircuit substrate DCB on which the data driving chip DC is mounted. Thedata driving chip DC may be provided in plurality, such as in one-to-onecorrespondence with the data circuit substrates DCB. According to anembodiment, the data circuit substrate DCB may be provided as a flexibleprinted circuit. The data circuit substrate DCB electrically connectsthe main circuit substrate PB and the first substrate 100 to each other.The plurality of driving chips DC provide data signals corresponding todata lines among the plurality of data lines DL1 to DLm.

According to an embodiment of the invention, the data circuit substrateDCB may be disposed on a side surface among the side surfaces of thedisplay panel DP, which does not include the gate driving unit GDC. Inother words, the data circuit substrate DCB is not disposed on the topsurface of the substrate of the display panel DP, but is disposed on aside surface of the display panel DP, and therefore the display area DAof the display panel DP may be increased by the decreased non-displayarea NDA.

According to an embodiment of the invention, the gate control signaloutput from the signal control unit SC may be provided to the gatecircuit substrate GCB via the data circuit substrate DCB closest to thegate circuit substrate GCB from among data circuit substrates. Referringto FIG. 2, for example, a substrate dummy line BSL may be disposed onthe data circuit substrate DCB to be connected to the display panel DP,the substrate dummy line BSL delivering the gate control signal outputfrom the signal control unit SC to the gate circuit substrate GCB viaconductive (signal) lines (not shown) disposed within the display panelDP.

The data driving unit DDC is described as provided in plurality, but isnot limited thereto. In other words, the data driving unit DDC may alsobe provided in a single data driving unit to generate the grayscalevoltages. In an embodiment, for example, the display device DD includingone single data driving unit may be applied to a mobile phone, etc.

FIG. 4 is an enlarged top plan view of an embodiment of the area AAshown in FIG. 3. The top plan view illustrated in FIG. 4 may be a planview of the first substrate 100 of the display panel DP with the secondsubstrate 200 omitted, for convenience of explanation. The area AA isdisposed at an edge portion of the display device DD at an edge portionof the first substrate 100 of the display panel DP.

According to FIG. 4, for convenience of explanation, any one of the gatedriving units GDC connected to the display panel DP illustrated in FIG.2 is shown, and any one of the data driving units DDC is shown. Inaddition, through FIG. 4, a gate driving chip GC mounted on the gatecircuit substrate GCB and a data driving chip DC mounted on the datacircuit substrate DCB are omitted for convenience of explanation.

In detail, referring to FIG. 4, the display panel DP may include aplurality of signal lines overlapping the display area DA and thenon-display area NDA. Here, the signal lines may include data lines,gate lines and a dummy line.

Each of the gate lines GL may include or define a gate pad (portion)unit GL-P and a gate line (portion) unit GL-L. The gate line unit GL-Loverlaps the display area DA and the non-display area NDA. The gate padunit GL-P overlaps the non-display area NDA and is connected to aterminal end of the gate line unit GL-L.

Each of the data lines DL may include a data pad (portion) unit DL-P anda data line (portion) unit DL-L. The data line unit DL-L overlaps thedisplay area DA and the non-display area NDA. The data pad unit DL-Poverlaps the non-display area NDA and is connected to a terminal end ofthe data line unit DL-L.

The dummy line DSL overlaps the non-display area NDA, and includes agate dummy pad (portion) unit DSL-P1, a data dummy pad (portion) unitDSL-P2 and a dummy line (portion) unit DSL-L for connecting the gatedummy pad unit DSL-P1 and the data dummy pad unit DSL-P2 to each other.The gate dummy pad unit DSL-P1 is connected to a first end of the dummyline unit DSL-L, and the data dummy pad unit DSL-P2 is connected to asecond end of the dummy line unit DSL-L opposing the first end thereof.The data dummy pad unit DSL-P2 may be disposed more closely adjacent tothe gate circuit substrate GCB than to the data pad unit DL-P. Forconvenience of explanation, the dummy line DSL is shown as one, but maybe provided in plurality.

The dummy line DSL may be electrically connected to a substrate dummyline BSL (see to FIG. 2) disposed on the data circuit substrate DCB.Accordingly, the dummy line DSL may deliver the gate control signaldelivered through the substrate dummy line BSL to the gate circuitsubstrate GCB. The gate driving chip GC (see to FIG. 2) disposed on thegate circuit substrate GCB may output gate signals corresponding to thegate lines GL in response to the gate control signal delivered throughthe dummy line DSL.

The gate circuit substrate GCB may be disposed on one of the sidesurfaces of the display panel DP. In detail, the gate circuit substrateGCB may be disposed on one of side surfaces of the first substrate 100(see FIG. 1). The gate circuit substrate GCB may include a gate drivingpad (portion) unit GPD and a first dummy driving pad (portion) unitD-GPD.

The gate driving pad unit GDP may be provided in plurality incorrespondence to the number of the gate lines GL, and the plurality ofgate driving pad units GDP are respectively and electrically connectedto the gate lines GL. The first dummy driving pad unit D-GPD may beelectrically connected to the dummy line DSL to receive the gate controlsignal. The first dummy driving pad unit D-GDP may be electricallyconnected to the gate driving chip GC (see FIG. 2). The gate drivingchip GC receives the gate control signal through the first dummy drivingpad unit D-GPD, and outputs a gate signal corresponding to the gatedriving pad unit GDP in response to the gate control signal.

The data circuit substrate DCB may be disposed on another one of theside surfaces of the display panel DP at which the gate circuitsubstrate GCB is not disposed. The data circuit substrate DCB mayinclude a data driving pad unit DPD and a second dummy driving pad unitD-DPD.

The data driving pad unit DDP may be provided in plurality in order tocorrespond to the number of the data lines DL, and the plurality of datadriving pad units DDP are respectively and electrically connected to thedata lines DL. The second dummy driving pad unit D-DPD may beelectrically connected to the dummy line DSL to receive the gate controlsignal from the signal control unit SC. In other words, the gate controlsignal may be delivered to the dummy line DSL through the second dummydriving pad unit D-DPD.

According to an embodiment of the invention, the first substrate 100 mayinclude a first connection electrode GCN for electrically connecting thegate driving pad unit GPD and the gate pad unit GL-P to each other. Thefirst connection electrode GCN may be provided in plurality forrespectively connecting the plurality of gate driving pad units GPD andthe plurality of gate pad units GL-P to each other. Here, the pluralityof first connection electrodes GCN include a connection electrode forelectrically connecting the first dummy driving pad unit D-GPD and thegate dummy pad unit DSL-P1 to each other.

The first connection electrode GCN may be electrically connected withthe gate driving pad unit GPD through an anisotropic conductive film AF.The anisotropic conductive film AF includes a conductive particle PIprovided in plurality inside an adhesive film PF having adhesiveness.The conductive particles PI electrically conduct the first connectionelectrode GCN of the first substrate 100 and the gate driving pad unitGPD of the gate driving unit GDC to each other.

The first substrate 100 may include a first etched part defined in thenon-display area NDA, to be described later. The first etched part maybe disposed or formed on the first substrate 100 to be adjacent to oneof the above-described side surfaces of the first substrate 100 at whicha driving unit is disposed. The first substrate 100 includes a pluralityof first etched parts, and the plurality of first connection electrodesGCN may be respectively disposed on the plurality of first etched parts.In other words, the gate driving pad unit GPD and the gate pad unit GL-Pare electrically connected to each other through the first connectionelectrode GCN disposed on the first etched part. A structure of thefirst connection electrode GCN will be described in detail in relationto FIGS. 5A and 5B.

According to an embodiment of the invention, the first substrate 100 mayinclude a second connection electrode DCN for electrically connectingthe data driving pad unit DPD and the data pad unit DL-P to each other.The second connection electrode DCN may be provided in plurality forrespectively connecting the plurality of data driving pad units DPD andthe plurality of data pad units DL-P to each other. Here, the pluralityof second connection electrodes DCN include a connection electrode forelectrically connecting a second dummy driving pad unit D-DPD and thedata dummy pad unit DSL-P2 to each other.

The second connection electrode DCN may be electrically connected withthe data driving pad unit DPD through the anisotropic conductive filmAF. In other words, the conductive particles PI electrically connect thesecond connection electrode DCN and the data driving pad unit DPD toeach other.

The first substrate 100 may include a second etched part defined in thenon-display area NDA, to be described later. The second etched part maybe disposed or formed on the first substrate 100 to be adjacent toanother one of the above-described side surfaces of the first substrate100 at which a driving unit is disposed. The first substrate 100includes a plurality of second etched parts, and the plurality of secondconnection electrodes DCN may be respectively disposed on the pluralityof second etched parts. In other words, the data driving pad unit DPDand the data pad unit DL-P are electrically connected to each otherthrough the second connection electrode DCN disposed on the secondetched part. Similarly, a structure of the second connection electrodeDCN will be described in detail in relation to FIGS. 5A and 5B.

FIG. 5A is a cross-sectional view of an embodiment of the area AA alongI-I′ shown in FIG. 4 according to the invention. FIG. 5B is across-sectional view of a modified embodiment of the area AA along I-I′shown in FIG. 4 according to the invention.

In FIGS. 5A and 5B, a connection structure of any one data line DLillustrated in FIG. 4 and the second connection electrode DCN isillustrated, but the invention is not limited thereto. In other words,each of the plurality of gate lines GL and the plurality of data linesDL may be connected to a respective connection electrode in theconnection structure illustrated in FIGS. 5A and 5B.

In detail, referring to FIG. 5A, the first substrate 100 includes anupper surface US, a lower surface DS facing the upper surface US, and aside surface SS for connecting the upper surface and the lower surfaceto each other. Here, the side surface SS may correspond to theabove-described side surface from among the side surfaces of the firstsubstrate 100 at which the data driving unit DDC is disposed.

The upper surface US may include the display area DA at which an imageis actually displayed and the non-display area NDA at which the image isnot displayed. In particular, the upper surface US includes or isdefined by a horizontal (portion) part US-P perpendicular to the thirddirection DR3 and parallel to the second direction DR2, and a diagonal(inclined portion) part US-B (see FIG. 6B) which is inclined from thehorizontal part US-P and connected to the side surface SS. A maximumthickness of the first substrate 100 may be defined at the horizontalpart US-P.

The horizontal part US-P may overlap or be disposed in the display areaDA and the non-display area NDA, and the diagonal part US-B may overlapthe non-display area NDA. In particular, the non-display area NDAillustrated in FIG. 5A may include a horizontal area NDA-PA and adiagonal area NDA-BA. The data pad unit DL-P and a data line unit DL-Lmay be disposed on the upper surface US overlapping the horizontal areaNDA-PA.

According to an embodiment of the invention, the diagonal part US-B (seeFIG. 6B) may be etched to a certain depth in the third direction DR3along the thickness direction of the first substrate 100, with referenceto the horizontal part US-P. Hereinafter, the resulting part at whichthe diagonal part US-B has been etched will be described as an uppersurface etched part OPU. The upper surface etched part OPU forms a stepwith the horizontal part US-P. The second connection electrode DCN maybe disposed at the upper surface etched part OPU to electrically contactthe data pad unit DL-P. In other words, the second connection electrodeDCN may not be disposed at the original (un-etched) diagonal part US-Bwhich overlaps the diagonal area NDA-BA, but is disposed on theresulting upper surface etched part OPU as being an etched portion ofthe substrate 100 at the diagonal part US-B. That is, the upper surfaceetched part OPU is an etched surface of the first substrate 100 recessedfrom the horizontal part US-P, to form a step with the horizontal partUS-P.

The lower surface DS includes a first part DS-P perpendicular to thethird direction DR3 and parallel to the second direction DR2, andincludes a second part DS-B which is inclined from the first part DS-P.Here, the first part DS-P may face the horizontal part US-P and besymmetric to each other on the basis of the second direction DR2. Thesecond part DS-B may face the diagonal part US-B and be symmetric toeach other on the basis of the second direction DR2.

As described above, the non-display area NDA of the first substrate 100includes the horizontal area NDA-PA and the diagonal area NDA-BA. In aconventional structure, when an external impact is applied to thehorizontal area of the display device DD, the impact may be applied toboth of the first substrate 100 and the second substrate 200 and adisplaying surface may be damaged.

However, the display device DD according to one or more embodiment ofthe invention, when a relatively strong external impact is applied tothe diagonal area NDA-BA of the display device DD, the external impactmay be concentrated on the diagonal area NDA-BA to be reduced oreffectively prevented from being delivered to the horizontal areaNDA-PA. As a result, the display surface corresponding to the displayarea DA at which an image is displayed may be generally protected.

According to an embodiment of the invention, the side surface SS mayconnect the diagonal part US-B and the second part DS-B to each other.The side surface SS of the first substrate 100 (see FIG. 6B) may beetched to a certain depth in the second direction DR2 that isperpendicular to the thickness direction of the first substrate 100.Hereinafter, the resulting part at which the side surface SS has beenetched will be described as a side surface etched part OPS. That is,side surface etched part OPS is an etched surface of the first substrate100 recessed from the side surface SS, to form a step with the sidesurface SS. The upper side surface etched part OPU may have a shape thatis extended from the side surface etched part OPS. The second connectionelectrode DCN may be further disposed at the side surface etched partOPS and electrically connected to the data driving pad unit DPD throughthe anisotropic conductive film AF. The second connection electrode DCNis exposed outside the first substrate 100 at both the upper sidesurface etched part OPU and the side surface etched part OPS.

In other words, the second connection electrode DCN is disposed as aunified shape along the upper surface etched part OPU and the sidesurface etched part OPS. A first end of the second connection electrodeDCN electrically contacts the data pad unit DL-P, and a second end ofthe second connection electrode DCN opposite to the first end thereof iselectrically connected to the data driving pad unit DPD through theisotropic conductive film AF.

In addition, according to an embodiment of the invention, an auxiliaryconnection electrode CN may be disposed on the second connectionelectrode DCN which overlaps the diagonal area NDA-BA. In other words,the auxiliary connection electrode CN is disposed on the secondconnection electrode DCN to make electrical connection of the secondconnection electrode DCN and the data pad unit DL-P easier. However, thesecond connection electrode DCN may be omitted according to anembodiment.

The second substrate 200 is disposed on the first substrate 100 so as toface the horizontal part US-P of the upper surface US of the firstsubstrate 100. A common electrode CE providing a common voltage topixels PX shown in FIG. 2 and a color filter (not shown), etc., may bedisposed on the second substrate 200. As an example, the commonelectrode CE and the color filter are described as disposed on thesecond substrate 200 in relation to FIGS. 5A and 5B, but the inventionis not limited thereto. In other words, the common electrode CE and thecolor filter may be disposed on the first substrate 100.

A substrate combining member SB may overlap the horizontal area NDA-PAand be disposed between the first substrate 100 and the second substrate200. The substrate combining member SB may have a frame shape in the topplan view so as to overlap the horizontal area NDA-PA and be disposedbetween the first substrate 100 and the second substrate 200 at allsides of the display device DD. The substrate combining member SB may bean adhesive member, without being limited thereto, and functions tocouple the first and second substrates 100 and 200 to each other.

In comparison with FIG. 5A, in FIG. 5B, the structure of the auxiliaryetched part obtained by etching the horizontal part US-P of the uppersurface US to a certain depth in the third direction DR3 is furtherdisclosed, but the remaining structure may be substantially the same.

In detail, referring to FIG. 5B, the horizontal part US-P overlaps thehorizontal area NDA-PA and includes the auxiliary etched part OPZ as aresult of the first substrate 100 at the horizontal part US-P thereofbeing etched to a certain depth in the third direction DR3.

The second connection electrode DCN is further disposed on the auxiliaryetched part OPZ. In other words, the second connection electrode DCN maybe disposed in a unified shape along the side surface etched part OPS,the upper surface etched part OPU and the auxiliary etched part OPZ. Inparticular, one area of the data pad unit DL-P overlaps the auxiliaryetched part OPZ in the third direction DR3 and one area of the data padunit DL-P is disposed on the second connection electrode DCN.

FIGS. 6A to 6E are cross-sectional views showing an embodiment of amanufacturing method of a display device according to the invention.

Referring to FIG. 6A, the first substrate 100 is provided whichinitially includes the upper surface US, the lower surface DS and theside surfaces SS. As described above in relation to FIG. 5A, the firstsubstrate 100 includes the display area DA and the non-display area NDA,and the non-display area NDA includes portions corresponding to thehorizontal area NDA-PA and the diagonal area NDA-BA. As an example, inthe top plan view, the horizontal area NDA-PA encloses the display areaDA and the diagonal area NDA-BA encloses the horizontal area NDA-PA. Asanother example, the non-display area NDA may not be disposed at allsides of the display area DA so as to not enclose the display area DA,but may be disposed adjacent to only one side of the display area DA.

Referring to FIG. 6B, portions CAa and CAb of the first substrate 100 atthe upper surface US and the lower surface DS of the first substrate100, which overlap the diagonal area NDA-BA, are removed. As a result,in the third direction DR3, a thickness of the first substrate 100 atthe diagonal area NDA-BA may be different from a thickness of the firstsubstrate 100 at the display area DA and at the horizontal area NDA-PA.In the third direction DR3, thicknesses of the first substrate 100 atthe display area DA and at the horizontal area NDA-PA may be the same.

Accordingly, the upper surface US may be modified by etching to includethe horizontal part US-P overlapping the display area DA and thehorizontal area NDA-PA, and the diagonal part US-B overlapping thediagonal area NDA-BA. In this case, the diagonal part US-B may beprovided in a shape inclined from the horizontal part US-P andconnecting the horizontal part US-P and the side surface SS to eachother. In other words, a total thickness of the first substrate 100 atthe diagonal part US-B may be reduced in a direction towards the sidesurface SS from the horizontal area NDA-PA.

The lower surface DS may be modified to include the first part DS-Poverlapping the display area DA and the horizontal area NDA-PA, and thesecond part DS-B overlapping the diagonal area NDA-BA. In this case, thesecond part DS-B may be provided in a shape inclined from the first partDS-P and connecting the first part DS-P and the side surface SS to eachother. In other words, the total thickness of the second part DS-B maybe reduced in a direction towards the side surface SS from the firstpart DS-P.

The diagonal part US-B and the second part US-B may be symmetric withreference to a virtual line extended along the second direction DR2. Inaddition, as shown in FIG. 6B, the diagonal part US-B and the secondpart DS-B are shown in a straight line shape, but are not limitedthereto. In an embodiment, for example, the diagonal part US-B and thesecond part US-B may be provided in various shapes such as a curved lineshape. The side surface SS is also shown in a straight line shape, butis not limited thereto and may be provided in various shapes such as acurve line.

Referring to FIG. 6C, the first substrate 100 may be further etched atthe diagonal part US-B (shown in dotted line) of the upper surface US toa certain depth along the third direction DR3 from the horizontal partUS-P. The first substrate 100 may also be etched at the side surface SSthereof to a certain depth along the second direction DR2 from the sidesurface SS. FIG. 6C shows that not the entire area, but a part of theside surface SS extended in the third direction DR3 is etched along thesecond direction DR2. An un-etched portion of the side surface SS formsa step shape with the side surface etched part OPS. However, theinvention is not limited thereto, and the entire area of the sidesurface SS in the third direction DR3 may be etched to a certain depth,such that no step shape is formed.

As a result, as the diagonal part US-B of the first substrate 100 isfurther etched, the upper surface US may be modified to include thehorizontal part US-P and the upper surface etched part OPU. In addition,the side surface SS is modified to include the side surface etched partOPS and a remaining un-etched portion of the side surface SS.

Referring to FIG. 6D, the second connection electrode DCN may bedisposed in a unified shape along the upper surface etched part OPU andthe side surface etched part OPS. Here, the second connection electrodeDCN may be formed from a metal material including such as copper (Cu),silver (Ag), gold (Au) or aluminum (Al).

In addition, as a method for forming the second connection electrode DCNalong the upper etched part OPU and the side surface etched part OPS,various methods such as a method for forming an electrode through alaser after metal material deposition, or a silk screen method may beadopted.

Referring to FIG. 6E, any one data line DL from among the signal linesis disposed at the horizontal part US-P. The data pad unit DL-P iselectrically connected to the second connection electrode DCN and isdisposed on the horizontal part US-P so as to overlap the horizontalarea NDA-PA. The data line unit DL-L is electrically connected to thedata pad unit DL-P and is disposed on the horizontal part US-P so as tooverlap the horizontal area NDA-PA and the display area DA.

FIG. 7 is an enlarged top plan view of another embodiment of area AAshown in FIG. 3 according to the invention. FIG. 8 is a cross-sectionalview of the area AA along II-II′ shown in FIG. 7.

In comparison with the top plan view of the first substrate 100illustrated in FIG. 4, a top plan view of the first substrate 100illustrated in FIG. 7 does not disclose a configuration of theconnection electrodes GCN and DCN, but the remaining structure andoperation scheme may be the same. Accordingly, a description thereaboutwill be omitted.

Referring to FIG. 8, in comparison with the first substrate 100illustrated in FIG. 5A, a first substrate 100 a has a diagonal areaNDA-BA different therefrom, but the remaining structure and operationscheme may be substantially the same.

According to FIG. 8, the first substrate 100 a at the non-display areaNDA is illustrated. In other words, the non-display area NDA of FIG. 8may be implemented only with the horizontal area NDA-PA illustrated inFIG. 5A and excluding the diagonal area NDA-BA thereof.

According to an embodiment of the invention, a portion of the firstsubstrate 100 a adjacent to a side surface SS may be etched to a certaindepth in the third direction DR3 from an upper surface US (see FIG. 6A)of the first substrate 100 a. The first substrate 100 a may also beetched from the side surface SS (see FIG. 6A) to a certain depth alongthe second direction DR2. Hereinafter, a resulting part of the firstsubstrate 100 a which has been etched from the upper surface US will bedescribed as an upper surface etched part OPUa and a resulting part ofthe first substrate 100 a which has been etched from the side surface SSwill be described as a side surface etched part OPSa. The upper(horizontal) surface etched part OPUa forms a step with the horizontalpart US-P.

The connection electrode DCNa is disposed in a unified shape along theupper surface etched part OPUa and the side surface etched part OPSa.The connection electrode DCNa is described as disposed in an etched partof the first substrate 100 in a unified shape, but is not limitedthereto. In other words, the connection electrode DCNa may be disposedat the various etched parts of the first substrate 100 a in a dividedstructure (e.g., as a collection of separate portions) as an overallstructure for electrically connecting the circuit substrate and thesignal pad unit.

The data pad unit DL-P may be disposed to directly and electricallycontact the connecting electrode DCNa. In other words, at least one areaNTa (dotted line box) of the data pad unit DL-P may overlap theconnection electrode DCNa in the third direction DR3.

In comparison with the non-display area NDA of the first substrate 100illustrated in FIG. 5A, a width of the non-display area NDA of the firstsubstrate 100 a illustrated in FIG. 8 may be further reduced asincluding the connection electrode DCNa within a boundary of a secondsubstrate 200 a facing the first substrate 100 a and the first substrate100 a excluding the diagonal area NDA-BA. For the first substrate 100 ofFIG. 5A, the connection electrode DCN is disposed on the diagonal areaNDA-BA, but for the first substrate 100 a of FIG. 8, the connectionelectrode DCNa may be directly disposed on the horizontal area NDA-PA tooverlap the data pad unit DL-P. Accordingly, the first substrate 100 amay include the non-display area NDA reduced by the diagonal NDA-BA ofFIG. 5A.

FIG. 9 is an enlarged cross-sectional view of another embodiment of adisplay device according to the invention. FIG. 10 is a cross-sectionalview of the display device along shown in FIG. 9.

Referring to FIGS. 9 and 10, a part of the first substrate 100 b in thenon-display area NDA is illustrated.

The non-display area NDA of the first substrate 100 b includes thehorizontal area NDA-PA and the diagonal area NDA-BA. In an embodiment,for example, the first substrate 100 b illustrated in FIG. 9 may beprovided in a shape of the first substrate 100 illustrated in FIG. 6B.The second substrate 200 b faces the horizontal area NDA-PA and thedisplay area DA of the first substrate 100 b.

In comparison with the first substrate 100 illustrated in FIG. 5A, thefirst substrate 100 b illustrated in FIG. 9 does not include a separateetched part in the diagonal area NDA-BA. That is, the surfaces of thefirst substrate 100 illustrated in FIG. 6B may not be further etched tomaintain the upper surface US and the lower surface DS as illustrated inFIG. 6B.

According to an embodiment of the invention, on the diagonal part US-Bof the upper surface US, diagonal connection electrodes MT1 may berespectively disposed to correspond to the number of data pad unitsDL-P. The diagonal part US-B is extended directly from the horizontalpart US-P such that no step is formed therebetween. The diagonalconnection electrodes MT1 respectively and electrically contact the datapad units DL-P. In addition, on the side surface SS, side surfaceconnection electrodes MT2 may respectively disposed to be electricallyconnected to the diagonal connection electrodes MT1. The side surfaceconnection electrodes MT2 may be electrically connected with the datadriving pad units DPD included on the data circuit substrate DCB throughthe anisotropic conductive film AF. The diagonal connection electrodeMT1 and the side surface connection electrode MT2 may be provided in aunified shape or be separate elements connected to each other.

As a method for forming the diagonal connection electrodes MT1 on thediagonal part US-B and a method for forming the side surface connectionelectrodes MT2 on the side surface SS, a method for forming an electrodethrough a laser after deposition of a metal material or a silk screenmethod, etc. may be variously adopted.

According to one or more embodiment of the invention, a substrate of adisplay panel may include an etched area in a non-display area thereof.In particular, a connection electrode for electrically contacting asignal-providing circuit substrate and a signal pad of the display panelmay be disposed in the etched area. In addition, a bezel of the displaydevice may be generally reduced, since a signal-providing circuitsubstrate pad is disposed on a side surface of the substrate, not on anupper surface thereof.

As described above, the embodiments are disclosed in the drawings andspecification. Herein, specific terms have been used, but are just usedfor the purpose of describing the invention and are not used fordefining the meaning or limiting the scope of the invention, which isdisclosed in the appended claims. The above-disclosed subject matter isto be considered illustrative and not restrictive, and the appendedclaims are intended to cover all such modifications, enhancements, andother embodiments, which fall within the true spirit and scope of theinvention. Thus, to the maximum extent allowed by law, the scope of theinvention is to be determined by the broadest permissible interpretationof the following claims and their equivalents, and shall not berestricted or limited by the foregoing detailed description.

What is claimed is:
 1. A manufacturing method of a display device, the manufacturing method comprising: etching a first portion of a substrate of display panel which displays an image with light, at an upper surface of the substrate, the etching the first portion reducing a thickness of the substrate at a non-display area of the display panel; etching a second portion of the substrate, a side surface thereof, the second portion extending from the first portion to be connected therewith; disposing a connection electrode in the first etched portion and in the second etched portion of the substrate; disposing outside of the first and second etched portions of the substrate, a signal line on the upper surface, to contact the connection electrode disposed in the first and second etched portions; and disposing a circuit substrate on the side surface at which the second portion is etched to be electrically connected to the connection electrode disposed in the first and second etched portions.
 2. The manufacturing method according to claim 1, wherein in the non-display area, the signal line outside of the first and second etched portions of the substrate extends to be disposed overlapping the connection electrode disposed in the first and second etched portions.
 3. The manufacturing method according to claim 1, wherein in the non-display area, the upper surface comprises a horizontal portion on which the signal line is disposed, the horizontal portion disposed in a plane defined by first and second direction, and the first etched portion in which the connection electrode is disposed is inclined from the horizontal portion to the second etched portion.
 4. The manufacturing method according to claim 3, wherein in the non-display area, an end surface of the connection electrode faces and contacts an end surface of the signal line. 